New high-temp interconnection method withstands extreme heat for 100+ hours!
Researchers studied different ways to connect electronics in very high temperatures. They used computer simulations and tested actual connections at 500-800°C. A liquid-based connection had low stress but was hard to make work. A mechanical pressure-only connection failed under high stress. A nano-Ag paste connection showed high stress but worked well at 800°C for over 100 hours.
