The article presents a method to quickly find and fix problems affecting the yield of semiconductor products. By analyzing many parameters, it identifies the top five issues that reduce product yield. This method separates yield into two parts: systematic and random. By studying electrical test data, it pinpoints critical factors affecting yield. The method can determine the impact of sensitive parameters on yield and find the reasons for yield losses. It then suggests a plan to improve systematic yield. This approach has successfully helped manufacturing lines improve their product yield.