Strengthened punch design saves semiconductors from sudden breakage during manufacturing.
The goal of the research was to design a stiffened punch for stamping lead frames to prevent breakage. The researchers used buckling analysis to figure out where and how many stiffeners should be added to the punch. They compared the results of their analysis with actual buckling tests to make sure their design was accurate. Ultimately, they came up with guidelines for adding stiffeners to the punch to make it stronger and more durable.